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Environmental Resistance and Fatigue Behaviors of Epoxy/Nano-Boron Nitride Thermally Conductive Structural Film Adhesive Toughened by Polyphenoxy.

ABSTRACT: The thermally conductive structural film adhesive not only carries large loads but also exhibits excellent heat-transfer performance, which has huge application prospects. Herein, a novel epoxy (Ep) thermally conductive structural film adhesive was prepared using polyphenoxy (PHO) as the toughening agent and film former, boron nitride (BN) nanosheets as the thermally conductive filler, and polyester fabric as the carrier. When the amount of PHO in the epoxy matrix was 30 phr and the content of nano-BN was 30 wt.% (Ep/PHO30/nBN30), the adhesive resin system showed good film-forming properties, thermal stability, and thermal conductivity. The glass transition temperature of Ep/PHO30/nBN30 was 215 °C, and the thermal conductivity was 209.5% higher than that of the pure epoxy resin. The Ep/PHO30/nBN30 film adhesive possessed excellent adhesion and peeling properties, and the double-lap shear strength at room temperature reached 36.69 MPa, which was 21.3% higher than that of pure epoxy resin. The double-lap shear strength reached 15.41 MPa at 150 °C, demonstrating excellent high temperature resistance. In addition, the Ep/PHO30/nBN30 film adhesive exhibited excellent heat-aging resistance, humidity, and medium resistance, and the shear strength retention rate after exposure to the complicated environment reached more than 90%. The structural film adhesive prepared showed excellent fatigue resistance in the dynamic load fatigue test, the double-lap shear strength still reached 35.55 MPa after 1,000,000 fatigue cycles, and the strength retention rate was 96.9%, showing excellent durability and fatigue resistance.

SUBMITTER: Yue C

PROVIDER: S-EPMC8513045 | biostudies-literature |

REPOSITORIES: biostudies-literature

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Project description:Adhesion interaction of epoxy resin with the basal surfaces of h-BN and graphite is investigated with the first-principles density functional theory calculations in conjunction with the dispersion correction. The h-BN/epoxy and graphite/epoxy interfaces play an important role in producing nanocomposite materials with excellent thermal dissipation properties. The epoxy resin structure is simulated by using four kinds of fragmentary models. Their structures are optimized on the h-BN and graphite surfaces after an annealing simulation. The distance between the epoxy fragment and the surface is about 3 Å. At the interface between h-BN and epoxy resin, no H-bonding formation is observed, though one could expect that the active functional groups of epoxy resin, such as hydroxyl (-OH) group, would be involved in a hydrogen-bonding interaction with nitrogen atoms of the h-BN surface. The adhesion energies for the two interfaces are calculated, showing that these two interfaces are characterized by almost the same strength of adhesion interaction. To obtain the adhesion force-separation curve for the two interfaces, the potential energy surface associated with the detachment of the epoxy fragment from the surface is calculated with the help of the nudged elastic band method and then the adhesion force is obtained by using either the Morse-potential approximation or the Hellmann-Feynman force calculation. The results from both methods agree with each other. The maximum adhesion force for the h-BN/epoxy interface is as high as that for the graphite/epoxy interface. To better understand this result, a force-decomposition analysis is carried out, and it has been disclosed that the adhesion forces working at both interfaces mainly come from the dispersion force. The trend of increase in the C 6 parameters used for the dispersion correction for the atoms included in the h-BN or graphite surface is in the order: N < C < B, which reasonably explains why the strengths of the dispersion forces operating at the two interfaces are similar. Also, the electron localization function analysis can explain why the h-BN surface cannot form an H bond with the hydroxyl group in epoxy resin.

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Environmental Resistance and Fatigue Behaviors of Epoxy/Nano-Boron Nitride Thermally Conductive Structural Film Adhesive Toughened by Polyphenoxy.

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