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Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide.

ABSTRACT: The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m-1 K-1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.

SUBMITTER: Xia J

PROVIDER: S-EPMC8620080 | biostudies-literature | 2021 Oct

REPOSITORIES: biostudies-literature

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Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide.

Xia Juncheng J Qin Yue Y Wei Xianzhe X Li Linhong L Li Maohua M Kong Xiangdong X Xiong Shaoyang S Cai Tao T Dai Wen W Lin Cheng-Te CT Jiang Nan N Fang Shuangquan S Yi Jian J Yu Jinhong J

Nanomaterials (Basel, Switzerland) 20211028 11

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m<sup>-1</sup> K<su ...[more]

PMID: 34835656

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