Constructing Porous Alumina Frameworks by Sintering for Enhanced Thermal Conductivity of Polymer Composites
Ontology highlight
ABSTRACT:
SUBMITTER: Wu X
PROVIDER: S-EPMC9835650 | biostudies-literature | 2022 Dec
REPOSITORIES: biostudies-literature
Similar Datasets
Project description:Three-dimensional anodic alumina templates (3D-AAO) are an astonishing framework with open highly ordered three-dimensional skeleton structures. Since these templates are architecturally different from conventional solids or porous templates, they teem with opportunities for engineering thermal properties. By establishing the mechanisms of heat transfer in these frameworks, we aim to create materials with tailored thermal properties. The effective thermal conductivity of an empty 3D-AAO membrane was measured. As the effective medium theory was not valid to extract the skeletal thermal conductivity of 3D-AAO, a simple 3D thermal conduction model was developed, based on a mixed series and parallel thermal resistor circuit, giving a skeletal thermal conductivity value of approximately 1.25 W·m-1·K-1, which matches the value of the ordinary AAO membranes prepared from the same acid solution. The effect of different filler materials as well as the variation of the number of transversal nanochannels and the length of the 3D-AAO membrane in the effective thermal conductivity of the composite was studied. Finally, the thermal conductivity of two 3D-AAO membranes filled with cobalt and bismuth telluride was also measured, which was in good agreement with the thermal model predictions. Therefore, this work proved this structure as a powerful approach to tailor thermal properties.
| S-EPMC5146943 | biostudies-literature
Project description:Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10-1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.
| S-EPMC7844292 | biostudies-literature
Project description:A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3?nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7?wt% BNNSs is up to 2.95?W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44?W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.
| S-EPMC5784086 | biostudies-literature
Project description:Polymer composites have attracted increasing interest as thermal management materials for use in devices owing to their ease of processing and potential lower costs. However, most polymer composites have only modest thermal conductivities, even at high concentrations of additives, resulting in high costs and reduced mechanical properties, which limit their applications. To achieve high thermally conductive polymer materials with a low concentration of additives, anisotropic, solid-state drawn composite films were prepared using water-soluble polyvinyl alcohol (PVA) and dispersible graphene oxide (GO). A co-additive (sodium dodecyl benzenesulfonate) was used to improve both the dispersion of GO and consequently the thermal conductivity. The hydrogen bonding between GO and PVA and the simultaneous alignment of GO and PVA in drawn composite films contribute to an improved thermal conductivity (∼25 W m-1 K-1), which is higher than most reported polymer composites and an approximately 50-fold enhancement over isotropic PVA (0.3-0.5 W m-1 K-1). This work provides a new method for preparing water-processable, drawn polymer composite films with high thermal conductivity, which may be useful for thermal management applications.
| S-EPMC8289248 | biostudies-literature
Project description:One of the most important physical factors related to the thermal conductivity of composites filled with graphene nanoplatelets (GNPs) is the dimensions of the GNPs, that is, their lateral size and thickness. In this study, we reveal the relationship between the thermal conductivity of polymer composites and the realistic size of GNP fillers within the polymer composites (measured using three-dimensional (3D) non-destructive micro X-ray CT analysis) while minimizing the effects of the physical parameters other than size. A larger lateral size and thickness of the GNPs increased the likelihood of the matrix-bonded interface being reduced, resulting in an effective improvement in the thermal conductivity and in the heat dissipation ability of the composites. The thermal conductivity was improved by up to 121% according to the filler size; the highest bulk and in-plane thermal conductivity values of the composites filled with 20?wt% GNPs were 1.8 and 7.3?W/m·K, respectively. The bulk and in-plane thermal conductivity values increased by 650 and 2,942%, respectively, when compared to the thermal conductivity values of the polymer matrix employed (0.24?W/m·K).
| S-EPMC4879581 | biostudies-literature
Project description:In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.
| S-EPMC5453999 | biostudies-literature
Project description:Epoxy composites with ZnO powders characterized by different structures as inclusion are prepared and their thermal properties are studied. The experimental results demonstrate that the epoxy resins filled by tetrapod-shaped ZnO (T-ZnO) whiskers have the superior thermal transport property in comparison to ZnO micron particles (ZnO MPs). The thermal conductivity of ZnO/epoxy and T-ZnO/epoxy composites in different mass fraction (10, 20, 30, 40, 50 wt%) are respectively investigated and the suitable models are compared to explain the enhancement effect of thermal conductivity. The thermal conductivity of T-ZnO/epoxy composites with 50 wt% filler reaches 4.38 W m-1 K-1, approximately 1816% enhancement as compared to neat epoxy. In contrast, the same mass fraction of ZnO MPs are incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is because T-ZnO whiskers act as a thermal conductance bridge in the epoxy matrix. In addition, the other thermal properties of T-ZnO/epoxy composites are also improved. Furthermore, the T-ZnO/epoxy composite also presents a much reduced coefficient of thermal expansion (∼28.1 ppm K-1) and increased glass transition temperature (215.7 °C). This strategy meets the requirement for the rapid development of advanced electronic packaging.
| S-EPMC9079263 | biostudies-literature
Project description:In this study, we demonstrate the use of silicone/few-layered hexagonal boron nitride (FL-hBN) composites for heat dissipation applications. FL-hBN is synthesized via a green, facile, low-cost and scalable liquid exfoliation method using a jet cavitation process. The crystal structures, surface morphologies and specific surface areas of pristine h-BN and FL-hBN were characterized by XRD, SEM, TEM and AFM (atomic force microscopy). The results confirmed that FL-hBN with a thickness of ~4 nm was successfully obtained from the exfoliation process. In addition, we introduced both pristine h-BN and FL-hBN into silicone with different ratios to study their thermal properties. The results of the laser flash analysis indicate that the silicon/FL-hBN composite exhibited a higher thermal conductivity than that of the silicone/h-BN composite. With the optimal loading content of 30 wt.% FL-hBN content, the thermal conductivity of the composite could be enhanced to 230%, which is higher than that of silicone/h-BN (189%). These results indicate that jet cavitation is an effective and swift way to obtain few-layered hexagonal boron nitride that could effectively enhance the thermal conductivity of silicone composites.
| S-EPMC7570332 | biostudies-literature
Project description:Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.
| S-EPMC8401393 | biostudies-literature
Project description:The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m-1 K-1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.
| S-EPMC8620080 | biostudies-literature