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Key concepts behind forming-free resistive switching incorporated with rectifying transport properties.


ABSTRACT: This work reports the effect of Ti diffusion on the bipolar resistive switching in Au/BiFeO3/Pt/Ti capacitor-like structures. Polycrystalline BiFeO3 thin films are deposited by pulsed laser deposition at different temperatures on Pt/Ti/SiO2/Si substrates. From the energy filtered transmission electron microscopy and Rutherford backscattering spectrometry it is observed that Ti diffusion occurs if the deposition temperature is above 600°C. The current-voltage (I-V) curves indicate that resistive switching can only be achieved in Au/BiFeO3/Pt/Ti capacitor-like structures where this Ti diffusion occurs. The effect of Ti diffusion is confirmed by the BiFeO3 thin films deposited on Pt/sapphire and Pt/Ti/sapphire substrates. The resistive switching needs no electroforming process, and is incorporated with rectifying properties which is potentially useful to suppress the sneak current in a crossbar architecture. Those specific features open a promising alternative concept for nonvolatile memory devices as well as for other memristive devices like synapses in neuromorphic circuits.

SUBMITTER: Shuai Y 

PROVIDER: S-EPMC3713515 | biostudies-literature | 2013

REPOSITORIES: biostudies-literature

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Key concepts behind forming-free resistive switching incorporated with rectifying transport properties.

Shuai Yao Y   Ou Xin X   Luo Wenbo W   Mücklich Arndt A   Bürger Danilo D   Zhou Shengqiang S   Wu Chuangui C   Chen Yuanfu Y   Zhang Wanli W   Helm Manfred M   Mikolajick Thomas T   Schmidt Oliver G OG   Schmidt Heidemarie H  

Scientific reports 20130101


This work reports the effect of Ti diffusion on the bipolar resistive switching in Au/BiFeO3/Pt/Ti capacitor-like structures. Polycrystalline BiFeO3 thin films are deposited by pulsed laser deposition at different temperatures on Pt/Ti/SiO2/Si substrates. From the energy filtered transmission electron microscopy and Rutherford backscattering spectrometry it is observed that Ti diffusion occurs if the deposition temperature is above 600°C. The current-voltage (I-V) curves indicate that resistive  ...[more]

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